2015.08-2020.09 @ 3D integration program, imec and Thermal-mechanical lab, KU Leuven
This Ph.D. focuses on the modeling, design, fabrication, and characterization of a micro-scale liquid impingement cooler using advanced, yet cost-efficient, fabrication techniques. The main objectives are (a) development of a modeling methodology to optimize the cooler geometry; (b) exploring low-cost fabrication methods for the package level impingement jet cooler; (c) experimental thermal and hydraulic characterization and analysis of the fabricated coolers; (d) applying the direct impingement jet cooling solutions to different applications, such as bare die package, 2.5D interposer package, hot-spots targeted cooling and larger dia package.
2020.01-Now @ Stanford Nanoheat Lab
Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers: 2020.01
Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, 2020.10
Heterogeneous SiC Power Modules with Active Cooling, 2021.04