Journal Publications

First author ‘Bold’, Corresponding author ‘*’

  1. Wei, T. W.*, All-in-one design integrates microfluidic cooling into electronic chips, Nature, 585, 188-189 (2020) doi: 10.1038/d41586-020-02503-1. (Invited)

  2. Wei, T. W., Lin, Z., Asheghi, M., & Goodson, K. E*., Micro-channel Cooling Technique to Minimize Thermal Deformation of the X-ray and High-power Laser Optics, Journal of Physics: Conference Series, 2022.

  3. Wei, T. W.*, Hazra, S., Asheghi, M., & Goodson, K. E. Numerical Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3D Manifold Coolers, Journal of Electronic Packaging 2022.

  4. Wei, T. W.*, Oprins, H., Cherman, V., Qian, J., De Wolf, I., Beyne, E., & Baelmans, M. (2018). High Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices. IEEE Transactions on Power Electronics, 34(7), 6601-6612. (IF= 7.224)

  5. Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021. (4.947)

  6. Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip. Applied thermal engineering, 152, 308-318. (IF= 4.026)

  7. Wei, T. W.*, Oprins, H., Cherman, V., Yang, S., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9), 1815-1824. (IF= 1.86)

  8. Wei, T. W.*, Oprins, H., et al., Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications, in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, doi: 10.1109/TCPMT.2020.3045113. (IF= 1.86)

  9. Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2020). Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems. Applied Thermal Engineering, 164, 114535. (IF= 4.026)

  10. Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. (IF= 1.86)

  11. Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, T., "Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns [J]" in Applied Thermal Engineering, 2020. (IF= 4.026)

  12. Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels. Fluids, 4(3), 145.

  13. Oprins, H., Wei, T. W.*, et al., “A cold shower for chips [J]”, Chip Scale Review, Volume 22, Number 6, November, 2018: Page.26.

  14. Wei, T. W.*, Cai J., et al., Optimization and Evaluation of Sputtering Barrier/seed layer In Through Silicon Via for 3-D integration [J], Tsinghua Science and Technology, 2014, 19(2): 150-160. (IF=1.365)