Journal Publications

First author ‘Bold’, Corresponding author ‘*’

1. Wei, T. W.*, All-in-one design integrates microfluidic cooling into electronic chips, Nature, 585, 188-189 (2020) doi: 10.1038/d41586-020-02503-1. (Invited)

2. Wei, T. W.*, Oprins, H., Cherman, V., Qian, J., De Wolf, I., Beyne, E., & Baelmans, M. (2018). High Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices. IEEE Transactions on Power Electronics, 34(7), 6601-6612. (IF= 7.224)

3. Wei, T. W.*, Oprins, H., et al., Heat Transfer and Friction Factor Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets, Int. J. Heat Mass Transf, 2021. (4.947)

4. Wei, T. W.*, Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip. Applied thermal engineering, 152, 308-318. (IF= 4.026)

5. Wei, T. W.*, Oprins, H., Cherman, V., Yang, S., De Wolf, I., Beyne, E., & Baelmans, M. (2019). Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9), 1815-1824. (IF= 1.86)

6. Wei, T. W.*, Oprins, H., et al., Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications, in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, doi: 10.1109/TCPMT.2020.3045113. (IF= 1.86)

7. Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2020). Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems. Applied Thermal Engineering, 164, 114535. (IF= 4.026)

8. Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. (IF= 1.86)

9. Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, T., "Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns [J]" in Applied Thermal Engineering, 2020. (IF= 4.026)

10. Wei, T. W.*, Oprins, H., Cherman, V., Beyne, E., & Baelmans, M. (2019). Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels. Fluids, 4(3), 145.

11. Oprins, H., Wei, T. W.*, et al., “A cold shower for chips [J]”, Chip Scale Review, Volume 22, Number 6, November, 2018: Page.26.

12. Wei, T. W.*, Cai J., et al., Optimization and Evaluation of Sputtering Barrier/seed layer In Through Silicon Via for 3-D integration [J], Tsinghua Science and Technology, 2014, 19(2): 150-160. (IF=1.365)


Conference Proceedings

First author ‘Bold’, Corresponding author ‘*’

1. Wei, T. W.*, Oprins, H., Cherman, V., Yang, Z,. Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., & Baelmans, M., “Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1422-1429.

2. Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., & Baelmans, M. (2019, May). Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5 D Si Interposer Packages. In 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 1243-1252). IEEE.

3. Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, M. (2019, May). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (pp. 126-134). IEEE.

4. Wei, T. W., Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., & Baelmans, M. (2017, December). High efficiency direct liquid jet impingement cooling of high-power devices using a 3D shaped polymer cooler. In 2017 IEEE International Electron Devices Meeting (IEDM) (pp. 32-5). IEEE.

5. Wei, T. W., Oprins, H., Cherman, V., De Wolf, I., Beyne, E., Yang, S., & Baelmans, M. (2018, May). 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges. In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (pp. 2389-2396). IEEE.

6. Wei, T. W.*, Oprins, H., Cherman, V., De Wolf, I., Beyne, E., & Baelmans, T. (2018). Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications. In The 16th International Heat Transfer Conference. The Assembly for International Heat Transfer Conferences; Beijing, China.

7. Wei, T. W.*, Qiu X, Lo J C C, et al. Wafer level bumping technology for high voltage LED packaging[C]//2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2015: 54-57.

8. Wei, T. W.*, Wang Q., Cai J., et al. Performance and reliability study of TGV interposer in 3D integration[C]//2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). IEEE, 2014: pp. 601-605.

9. Wei, T. W.*, Wang, Q., Liu, Z., Li, Y., Wang, D., Wang, T., & Cai, J. (2012, December). A 3D integration testing vehicle with TSV interconnects. In 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (pp. 1-5). IEEE.

10. Wei, T. W.*, Cai J., Wang Q., et al. Copper filling process for small diameter, high aspect ratio through silicon via (TSV)[C]//2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. IEEE, 2012: 483-487. (Outstanding Paper Award)

11. Fei, G., Wei, T. W.*, Shi, Q., Guo, Y., Oprins, H., & Yang, S. Preliminary Study on Hybrid Manufacturing of the Electronic-Mechanical Integrated Systems (EMIS) via the LCD Stereolithography Technology. 30th Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference.


Patents

First author ‘Bold’, Corresponding author ‘*’

1. Wang Q*, Wei, T. W., “Adapter panel and manufacturing method and encapsulation structure thereof and bonding method for the adapter panel”, US15528049.

2. Cai J.*, Wei, T. W., Wang Q., “A Novel Temporary Bonding Method in 3D Integration System using Special Trenches”, China, CN 201310263752.2, Filed.

3. Cai J.*, Wei, T. W., Wang Q., “A Novel Fabrication and Assembly Method for Wafer Level Packaging using Cu Electroplated Interconnection”, China, CN 201310263685.4, Filed.

4. Cai J.*, Wei, T. W., Wang Q., “Structure and Fabrication Method of One Reconfigurable Antenna with Through Silicon Via Interposer”, China, CN 201310002584.1, Filed.

5. Cai J.*, Wei, T. W., Wang Q., “Structure and Fabrication Method of One Temporary Bonding Module for Thin Chip/Wafer Assembly”, China, CN 201410035388.9, Filed.

6. Cai J.*, Wei, T. W., Wang Q., “A Novel Method applied to Thin Chip/Wafer Bonding in 3D integration using Protective Structures”, China, CN 201410034813.2, Filed.

7. Wang Q., Wei, T. W., Cai J.*, “Structure and Assembly Method of Interposer Integration using TGV and Solder Ball Inserted Interconnection”, China, CN 201410665104.4, Filed.

8. Cai J.*, Wei, T. W., Wang Q., “Structure and Fabrication Method of Through Polymer Filled Via using High Density and Low Stress Interconnection”, China, CN 201410666123.9, Filed.

9. Cai J.*, Wei, T. W., Wang Q., “A novel Method for Tapered Via Profile Amendment using Polymer Filled Structure”, China, CN 201410664902.5, Filed.

10. Luo Y.*, Zhang Y., Wei, T. W., etc., “A novel Non-uniform Distribution of Semiconductor Lighting Radiator Structure”, China, CN 102620268 B, Issued.