Session chair of 2021 Symposium on Reliability for Electronics and Photonics Packaging
Session chair of 2021 Symposium on Reliability for Electronics and Photonics Packaging
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Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)11-12 November, 2021 Silicon Valley, CA USA
Session chair of Thermal and Design at 3DIC 2021
Session chair of Thermal and Design at 3DIC 2021
IEEE International 3D System Integration Conference (3DIC)November 15-18, 2021Raleigh, North Carolina, USA
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