Tiwei Wei was invited for a seminar talk at Stanford ME Thermofluids, Energy, and Propulsion Research Seminar, with the topic of "Heterogeneous 3D Integration and Advanced cooling", on 05/18/2022:: 4:15-5:30 pm, Building 520, Room 131
Tiwei Wei gave a seminar talk at SJSU on "Heat Transfer in Electronics", 03/25/2022
Tiwei Wei was elected as the 2022 Vice-chair of the IEEE Electronic Packaging Society (EPS) Silicon Valley Chapter
Tiwei Wei was admitted to the 2021 POETS Future Technical Leaders Program. http://poets-erc.org/ftlfellows
IEEE Electronics Packaging Society: Tiwei Wei joined the EPS Reliability Technical Committee, 2021 REPP (Reliability for Electronics and Photonics Packaging) organization committee, 2022 Electronics System-Integration Technology Conferences (ESTC), and 24th Electronics Packaging Technology Conference (EPTC) Technical Program Committee.
New Award: 2019 Government Award for Outstanding Self-Financed Students Abroad (国家优秀自费留学生奖学金) This prestigious award selects recipients worldwide for their outstanding academic achievements annually, among Chinese graduate students studying abroad in any discipline.
New Award: 2020 imec Ph.D. Excellence award. Three Ph.D. winners were selected among 200 Ph.D. students at imec, for their academic achievement and contributions inside and outside imec.
IEEE Electronics Packaging Society: Tiwei Wei joined the 2021 committee member of IEEE-EPS Silicon Valley Area Chapter, and responsible for the student program
IEEE Electronics Packaging Society: Tiwei Wei joined the Technical program committee of IEEE 3DIC 2021 Conference
Nature Article: 2021 - Tiwei Wei was invited to write a Nature News and Views paper, published in Nature.
Media interviews: Sep 2020 - Tiwei Wei has been interviewed by IEEE Spectrum, New Scientist, and Scientific American journalists for his views about the EPFL electronics cooling solutions.
Ph.D. Defense：Sep 15 2020 - Tiwei Wei has passed his Ph.D. defense!
Conference Talk: On October 27, 2020, Tiwei Wei was giving a video talk titled "Parametric Cfd Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3d Manifold Coolers" in session Power Electronics in 2020 IterPACK conference.
New Award: Tiwei Wei received the 2019 EPS ECTC Student Travel Awards. 10 winners are selected among the EPS ECTC student's papers.