Tiwei Wei (PI)

Semiconductor Packaging Laboratory (S-PACK)

(All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab)

About myself

Tiwei Wei is currently an Assistant Professor of Mechanical Engineering at Purdue University. He was the postdoc research scholar in the NanoHeat lab at Stanford University between 2020 and 2022, working with Prof. Kenneth E. Goodson and Adjunct Professor Mehdi Asheghi. He received his Ph.D. degree at the Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020, under the supervision of Prof. Martine Baelmans and Dr. Herman Oprins. He joined imec in 2015, starting the Ph.D. research by developing electronic cooling solutions for high-performance systems. Before joining imec, he worked as a researcher staff at Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, with a focus on advanced microelectronic packaging techniques.

Research Highlights

S-PACK Lab Vision: (website: https://alphalab-purdue.org/) Focus on the processing, materials, and architecture development for future advanced semiconductor interconnects and 2.5D/3D packaging, as well as efficient thermal management technologies and reliability characterizations. The applications cover microelectronics chips, LED, power electronic modules, Photonics, Quantum computing, and X-ray and high-power laser optics.

Heat Transfer in Advanced Semiconductor Interconnects & Packaging
Electronic Cooling & Efficient Thermal Packaging Materials
Thermal/Mechanical Simulation & Characterization
Materials, Processing & Architecture Development for Semiconductor Packaging
MEMS Fabrication for Extreme Heat Flux Microfluidic Cooling
Advanced Semiconductor Nanoscale 3D Interconnections
Novel Photonics & Quantum Packaging Technologies
Reliability Modeling & Characterization

Research Overview

Interdisciplinary

(Heat Transfer+Microelectronics)

Design, fabrication, assembly process development, and characterization of the advanced packaging techniques, including 2.5D interposer and 3D integrations.
Thermomechanical modeling of the advanced packages to minimize the thermal-induced mechanical stress and thermal deformation.
Advanced chip/package level cooling solutions (jet cooling and microchannel cooling), including microfluidic device fabrication, CFD modeling and thermal/fluid experimental characterization.

News Highlights

Tiwei Wei was elected as General Chair for the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP).
April 2023: Tiwei Wei became the Founder and Chair, IEEE EPS Central Indiana chapter https://r4.ieee.org/cis-eps/
Tiwei Wei was invited for a seminar talk at Stanford ME Thermofluids, Energy, and Propulsion Research Seminar, with the topic of "Heterogeneous 3D Integration and Advanced cooling", on 05/18/2022:: 4:15-5:30 pm, Building 520, Room 131
Tiwei Wei gave a seminar talk at SJSU on "Heat Transfer in Electronics", 03/25/2022
Tiwei Wei was elected as the 2022 Vice-chair of the IEEE Electronic Packaging Society (EPS) Silicon Valley Chapter
Tiwei Wei was admitted to the 2021 POETS Future Technical Leaders Program. http://poets-erc.org/ftlfellows
IEEE Electronics Packaging Society: Tiwei Wei joined the EPS Reliability Technical Committee, 2021 REPP (Reliability for Electronics and Photonics Packaging) organization committee, 2022 Electronics System-Integration Technology Conferences (ESTC), and 24th Electronics Packaging Technology Conference (EPTC) Technical Program Committee.
New Award: 2019 Government Award for Outstanding Self-Financed Students Abroad (国家优秀自费留学生奖学金) This prestigious award selects recipients worldwide for their outstanding academic achievements annually, among Chinese graduate students studying abroad in any discipline.
New Award: 2020 imec Ph.D. Excellence award. Three Ph.D. winners were selected among 200 Ph.D. students at imec, for their academic achievement and contributions inside and outside imec.
IEEE Electronics Packaging Society: Tiwei Wei joined the 2021 committee member of IEEE-EPS Silicon Valley Area Chapter, and responsible for the student program
IEEE Electronics Packaging Society: Tiwei Wei joined the Technical program committee of IEEE 3DIC 2021 Conference
Nature Article: 2021 - Tiwei Wei was invited to write a Nature News and Views paper, published in Nature.
Media interviews: Sep 2020 - Tiwei Wei has been interviewed by IEEE Spectrum, New Scientist, and Scientific American journalists for his views about the EPFL electronics cooling solutions.
Ph.D. Defense：Sep 15 2020 - Tiwei Wei has passed his Ph.D. defense!
Conference Talk: On October 27, 2020, Tiwei Wei was giving a video talk titled "Parametric Cfd Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3d Manifold Coolers" in session Power Electronics in 2020 IterPACK conference.
New Award: Tiwei Wei received the 2019 EPS ECTC Student Travel Awards. 10 winners are selected among the EPS ECTC student's papers.