Awards

August, 2024

Intel's 2024 Rising Star Faculty Award (8 recipients)

Recognizing his exceptional work in the field of advanced semiconductor packaging and chip/package level thermal management.

May. 2024

IEEE EPS / ECTC Student Travel Award (20 recipients)

Paper: “A Novel Copper Microporous-Assisted Bonding Method for Fine-Pitch Cu/Sn Microbump 3D Interconnects” PhD student: Keyu Wang

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Nov. 2023

Elevation to the grade of IEEE Senior Member

Only 10% of IEEE’s more than 400,000 members hold this grade, which requires extensive experience, and reflects professional maturity and documented achievements of significance.

Nov. 2023

Best Poster Presentation Award (3/30)

Mentored undergraduate student (Cole Bradford Stephens, Jaiveer Singh Brar)

Scalable Asymmetric Lifecycle Engagement (SCALE) HI/AP at Purdue

June. 2022

Best Poster Presentation Award (5/300)

Mentored undergraduate student: Modin, Andrew Evan

Summer Undergraduate Research Fellowship (SURF) at Purdue

Nov. 2022

Best Student Presentation Award

Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling, Ph.D. student: Shuhang Lyu

2022 IEEE Symposium on Reliability for Electronics & Photonics Packaging

Oct. 2020

IMEC Ph.D. Excellence Award (3/200)

(3 winners out of 200 PhD students at IMEC)

PhD. Thesis “High Efficiency Polymer based Direct Multi-jet Impingement Cooling Solution for High Power Devices”

Oct. 2019

FWO PhD Fellowship

Research Foundation Flanders (FWO) funding for studying at Stanford

May. 2019

IEEE EPS / ECTC Student Travel Award (10 recipients)

Paper: “First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet HotspotTargeted Cooler for High Power Applications”

2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

August, 2019

   2019 Chinese Government Award for Outstanding Self-financed Students Abroad (国家优秀自费留学生奖学金) 

August, 2019

   2019 FWO Fellowship for Long Term Research Stay, FWO, Belgium

Aug. 2013

Outstanding Paper Award (10 recipients)

Paper: Copper filling process for small diameter, high aspect ratio through silicon via (TSV)

2013 14th International Conference on Electronic Packaging Technology, IEEE ICEPT-HDP