Alpha Lab

(All-in-one for Packaging, Heat transfer and Assembly Lab)

About myself

I am an incoming Assistant Professor at Purdue University, Mechanical Engineering Department. I am currently a postdoctoral research scholar in the NanoHeat lab at Stanford University, working with Prof. Kenneth E. Goodson and Adjunct Professor Mehdi Asheghi. I received my Ph.D. degree at the Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020, under the supervising of Prof. Martine Baelmans and Dr. Herman Oprins. I joined imec in 2015, starting the Ph.D. research by developing electronic cooling solutions for high-performance systems. Before joining in imec, I worked as a researcher staff at Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, where I worked on advanced microelectronic packaging techniques.

Research Highlights

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Alpha Lab Vision: Focus on the thermal, mechanical, and reliability investigations of advanced electronic 3D packaging. The applications cover microelectronics chips, LED, power electronic modules, and X-ray and high-power laser optics.

  • Addressing process integration and reliability challenges for fine-pitch, high-density 3D integration system: Monolithic 3D Integration and Heterogeneous Integration

  • Thermomechanical modeling and characterization of advanced devices and packages: chip package interactions, FEM modeling, and thermal stress measurements

  • "Smart microfluidic cooling system” with advanced manufacturing technologies using MEMS and 3D packaging: Active flow control for dynamic power profiles

  • Advanced design optimization and fabrication: Topology optimization and Additive manufacturing of the package level cooling system.

Research Overview

Interdisciplinary

(Heat Transfer+Microelectronics)

  • Design, fabrication, assembly process development, and characterization of the advanced packaging techniques, including 2.5D interposer and 3D integrations.

  • Thermomechanical modeling of the advanced packages to minimize the thermal-induced mechanical stress and thermal deformation.

  • Advanced chip/package level cooling solutions (jet cooling and microchannel cooling), including microfluidic device fabrication, CFD modeling and thermal/fluid experimental characterization.

News Highlights

  1. Tiwei Wei was invited for a seminar talk at Stanford ME Thermofluids, Energy, and Propulsion Research Seminar, with the topic of "Heterogeneous 3D Integration and Advanced cooling", on 05/18/2022:: 4:15-5:30 pm, Building 520, Room 131

  2. Tiwei Wei gave a seminar talk at SJSU on "Heat Transfer in Electronics", 03/25/2022

  3. Tiwei Wei was elected as the 2022 Vice-chair of the IEEE Electronic Packaging Society (EPS) Silicon Valley Chapter

  4. Tiwei Wei was admitted to the 2021 POETS Future Technical Leaders Program. http://poets-erc.org/ftlfellows

  5. IEEE Electronics Packaging Society: Tiwei Wei joined the EPS Reliability Technical Committee, 2021 REPP (Reliability for Electronics and Photonics Packaging) organization committee, 2022 Electronics System-Integration Technology Conferences (ESTC) Technical Program Committee.

  6. New Award: 2019 Government Award for Outstanding Self-Financed Students Abroad (国家优秀自费留学生奖学金) This prestigious award selects recipients worldwide for their outstanding academic achievements annually, among Chinese graduate students studying abroad in any discipline.

  7. New Award: 2020 imec Ph.D. Excellence award. Three Ph.D. winners were selected among 200 Ph.D. students at imec, for their academic achievement and contributions inside and outside imec.

  8. IEEE Electronics Packaging Society: Tiwei Wei joined the 2021 committee member of IEEE-EPS Silicon Valley Area Chapter, and responsible for the student program

  9. IEEE Electronics Packaging Society: Tiwei Wei joined the Technical program committee of IEEE 3DIC 2021 Conference

  10. Nature Article: 2021 - Tiwei Wei was invited to write a Nature News and Views paper, published in Nature.

  11. Media interviews: Sep 2020 - Tiwei Wei has been interviewed by IEEE Spectrum, New Scientist, and Scientific American journalists for his views about the EPFL electronics cooling solutions.

  12. Ph.D. Defense：Sep 15 2020 - Tiwei Wei has passed his Ph.D. defense!

  13. Conference Talk: On October 27, 2020, Tiwei Wei was giving a video talk titled "Parametric Cfd Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3d Manifold Coolers" in session Power Electronics in 2020 IterPACK conference.

  14. New Award: Tiwei Wei received the 2019 EPS ECTC Student Travel Awards. 10 winners are selected among the EPS ECTC student's papers.

Media Reports

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