Alpha Lab
(All-in-one for Packaging, Heat transfer and Assembly Lab)
About myself
I am an Assistant Professor at Purdue University, Mechanical Engineering Department. I am currently a postdoctoral research scholar in the NanoHeat lab at Stanford University, working with Prof. Kenneth E. Goodson and Adjunct Professor Mehdi Asheghi. I received my Ph.D. degree at the Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020, under the supervising of Prof. Martine Baelmans and Dr. Herman Oprins. I joined imec in 2015, starting the Ph.D. research by developing electronic cooling solutions for high-performance systems. Before joining in imec, I worked as a researcher staff at Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, where I worked on advanced microelectronic packaging techniques.
Research Highlights
Alpha Lab Vision: Focus on the thermal, mechanical, and reliability investigations of advanced electronic 3D packaging. The applications cover microelectronics chips, LED, power electronic modules, and X-ray and high-power laser optics.
Addressing process integration and reliability challenges for fine-pitch, high-density 3D integration system: Monolithic 3D Integration and Heterogeneous Integration
Thermomechanical modeling and characterization of advanced devices and packages: chip package interactions, FEM modeling, and thermal stress measurements
"Smart microfluidic cooling system” with advanced manufacturing technologies using MEMS and 3D packaging: Active flow control for dynamic power profiles
Advanced design optimization and fabrication: Topology optimization and Additive manufacturing of the package level cooling system.
Research Overview
Interdisciplinary
(Heat Transfer+Microelectronics)
Design, fabrication, assembly process development, and characterization of the advanced packaging techniques, including 2.5D interposer and 3D integrations.
Thermomechanical modeling of the advanced packages to minimize the thermal-induced mechanical stress and thermal deformation.
Advanced chip/package level cooling solutions (jet cooling and microchannel cooling), including microfluidic device fabrication, CFD modeling and thermal/fluid experimental characterization.
News Highlights
Tiwei Wei was invited for a seminar talk at Stanford ME Thermofluids, Energy, and Propulsion Research Seminar, with the topic of "Heterogeneous 3D Integration and Advanced cooling", on 05/18/2022:: 4:15-5:30 pm, Building 520, Room 131
Tiwei Wei gave a seminar talk at SJSU on "Heat Transfer in Electronics", 03/25/2022
Tiwei Wei was elected as the 2022 Vice-chair of the IEEE Electronic Packaging Society (EPS) Silicon Valley Chapter
Tiwei Wei was admitted to the 2021 POETS Future Technical Leaders Program. http://poets-erc.org/ftlfellows
IEEE Electronics Packaging Society: Tiwei Wei joined the EPS Reliability Technical Committee, 2021 REPP (Reliability for Electronics and Photonics Packaging) organization committee, 2022 Electronics System-Integration Technology Conferences (ESTC) Technical Program Committee.
New Award: 2019 Government Award for Outstanding Self-Financed Students Abroad (国家优秀自费留学生奖学金) This prestigious award selects recipients worldwide for their outstanding academic achievements annually, among Chinese graduate students studying abroad in any discipline.
New Award: 2020 imec Ph.D. Excellence award. Three Ph.D. winners were selected among 200 Ph.D. students at imec, for their academic achievement and contributions inside and outside imec.
IEEE Electronics Packaging Society: Tiwei Wei joined the 2021 committee member of IEEE-EPS Silicon Valley Area Chapter, and responsible for the student program
IEEE Electronics Packaging Society: Tiwei Wei joined the Technical program committee of IEEE 3DIC 2021 Conference
Nature Article: 2021 - Tiwei Wei was invited to write a Nature News and Views paper, published in Nature.
Media interviews: Sep 2020 - Tiwei Wei has been interviewed by IEEE Spectrum, New Scientist, and Scientific American journalists for his views about the EPFL electronics cooling solutions.
Ph.D. Defense:Sep 15 2020 - Tiwei Wei has passed his Ph.D. defense!
Conference Talk: On October 27, 2020, Tiwei Wei was giving a video talk titled "Parametric Cfd Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3d Manifold Coolers" in session Power Electronics in 2020 IterPACK conference.
New Award: Tiwei Wei received the 2019 EPS ECTC Student Travel Awards. 10 winners are selected among the EPS ECTC student's papers.