Welcome to Tiwei's world

About myself

I am currently a postdoctoral research scholar in the NanoHeat lab at Stanford University, working with Prof. Kenneth E. Goodson and Adjunct Professor Mehdi Asheghi. I received my Ph.D. degree at the Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020, under the supervising of Prof. Martine Baelmans and Dr. Herman Oprins. I joined imec in 2015, starting the Ph.D. research by developing electronic cooling solutions for high-performance systems. Before joining in imec, I worked as a researcher staff at Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, where I worked on advanced microelectronic packaging techniques.

Research Highlights

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My research experience is focused on three major areas: thermal-fluidic sciences, micro-nano fabrication, and thermal/fluidic experimental characterization. The applications cover microelectronics (power density~200 W/cm2 ), power electronics (1 kW/cm2 ), and laser optics systems (200 W/cm2 ). I serve as an active reviewer for Nature, Int. J. Heat Mass Transf, IEEE CPMT, Applied Sciences, ASME Journal of Electronic Packaging, Energies, JMM, and Journal of Physics D: Applied Physics, and ASME Journal of Fluids Engineering.

Research Overview


(Heat Transfer+Microelectronics)

  • Thermal and Fluids Engineering

High-resolution thermal and flow measurements, analytical and numerical modeling for electronics cooling applications.

  • Engineering Design, CAD modeling, 3D Prototyping

Design innovative microfluidic structures for silicon-based fabrication and polymer additive manufacturing;

  • Micro/Nanofabrication, MEMS, Microfluidics

Extensive analysis, experimental characterizations and hand-on cleanroom fabrication experience

  • Microelectronics Packaging: 3D Integration

Thorough understanding of thermal, mechanical, and electrical properties of advanced packaging, and reliability and failure analysis for chip package interaction (CPI)

News Highlights

  1. Tiwei Wei was admitted to the 2021 POETS Future Technical Leaders Program. http://poets-erc.org/ftlfellows

  2. IEEE Electronics Packaging Society: Tiwei Wei joined the EPS Reliability Technical Committee and 2021 REPP (Reliability for Electronics and Photonics Packaging) organization committee.

  3. New Award: 2019 Government Award for Outstanding Self-Financed Students Abroad (国家优秀自费留学生奖学金) This prestigious award selects recipients worldwide for their outstanding academic achievements annually, among Chinese graduate students studying abroad in any discipline.

  4. New Award: 2020 imec Ph.D. Excellence award. Three Ph.D. winners were selected among 200 Ph.D. students at imec, for their academic achievement and contributions inside and outside imec.

  5. IEEE Electronics Packaging Society: Tiwei Wei joined the 2021 committee member of IEEE-EPS Silicon Valley Area Chapter, and responsible for the student program

  6. IEEE Electronics Packaging Society: Tiwei Wei joined the Technical program committee of IEEE 3DIC 2021 Conference

  7. Nature Article: 2021 - Tiwei Wei was invited to write a Nature News and Views paper, published in Nature.

  8. Media interviews: Sep 2020 - Tiwei Wei has been interviewed by IEEE Spectrum, New Scientist, and Scientific American journalists for his views about the EPFL electronics cooling solutions.

  9. Ph.D. Defense:Sep 15 2020 - Tiwei Wei has passed his Ph.D. defense!

  10. Conference Talk: On October 27, 2020, Tiwei Wei was giving a video talk titled "Parametric Cfd Study of Large Footprint (24 X 24mm2) Silicon-Based Embedded Microchannel-3d Manifold Coolers" in session Power Electronics in 2020 IterPACK conference.

  11. New Award: Tiwei Wei received the 2019 EPS ECTC Student Travel Awards. 10 winners are selected among the EPS ECTC student's papers.

Media Reports

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