Semiconductor Packaging Laboratory (S-PACK)

(All-in-one for Semiconductor Packaging, Heat transfer, and Assembly Lab)

About myself    

Tiwei Wei is currently an Assistant Professor of Mechanical Engineering at Purdue University. He was the postdoc research scholar in the NanoHeat lab at Stanford University between 2020 and 2022, working with Prof. Kenneth E. Goodson and Adjunct Professor Mehdi Asheghi. He received his Ph.D. degree at the Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020, under the supervision of Prof. Martine Baelmans and Dr. Herman Oprins. He joined imec in 2015, starting the Ph.D. research by developing electronic cooling solutions for high-performance systems. Before joining imec, he worked as a researcher staff at Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, with a focus on advanced microelectronic packaging techniques.

Research Highlights

S-PACK Lab Vision: (website: Focus on the processing, materials, and architecture development for future advanced semiconductor interconnects and  2.5D/3D packaging, as well as efficient thermal management technologies and reliability characterizations. The applications cover microelectronics chips, LED, power electronic modules, Photonics, Quantum computing, and X-ray and high-power laser optics. 

Research Overview


(Heat Transfer+Microelectronics)

News Highlights

Media Reports

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